Multilayer ceramic electronic component

ABSTRACT

A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. As viewed from at least one direction in the laminating direction, an end of the pair of insulating coating portions, which is located closest to a first principal surface, is located closer to the first principal surface than an end of the first external electrode and pair of second external electrodes, which is located closest to the first principal surface.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority to Japanese PatentApplication No. 2016-112717 filed on Jun. 6, 2016. The entire contentsof this application are hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a multilayer ceramic electroniccomponent.

2. Description of the Related Art

Japanese Patent Application Laid-Open No. 2013-55320 discloses athree-terminal vertically laminated multilayer ceramic capacitor. Themultilayer ceramic capacitor disclosed in Japanese Patent ApplicationLaid-Open No. 2013-55320 includes a ceramic body, internal electrodesformed within the ceramic body, an insulating layer formed on onesurface of the ceramic body, and external electrodes. The internalelectrodes include a first internal electrode and a second internalelectrode. The external electrodes include a first external electrode, asecond external electrode, and a third external electrode.

The ceramic body has a first surface and a second surface that areopposite to each other, a third surface, a fourth surface, a fifthsurface, and a sixth surface that connect the first surface and thesecond surface. The third surface and the fourth surface are opposite toeach other, whereas the fifth surface and the sixth surface are oppositeto each other.

The first external electrode and the third external electrode are eachextended from the first surface of the ceramic body, and formed over thethird surface or the fourth surface connected to the first surface. Onthe first surface of the ceramic body, the second external electrode islocated between the first external electrode and the third externalelectrode. The first external electrode and the third external electrodeare each connected to the first internal electrode. The second externalelectrode is connected to the second internal electrode.

The insulating layer is formed on each of the first surface, thirdsurface, and fourth surface of the ceramic body. The insulating layerincludes a first insulating layer and a second insulating layer. Thefirst insulating layer is located between the first external electrodeand the second external electrode on the first surface of the ceramicbody. The second insulating layer is located between the second externalelectrode and the third external electrode on the first surface of theceramic body.

In multilayer ceramic electronic components such as three-terminalvertically laminated multilayer ceramic capacitors, migration may becaused between external electrodes that differ in polarity, alongsidesurfaces of laminated bodies as fifth and sixth surfaces of ceramicbodies.

SUMMARY OF THE INVENTION

Preferred embodiments of the present invention provide multilayerceramic electronic components which are able to significantly reduce orprevent migration alongside surfaces of a laminated body.

A multilayer ceramic electronic component in accordance with a preferredembodiment of the present invention includes a laminated body, a firstexternal electrode, a pair of second external electrodes, and a pair ofinsulating coating portions. The laminated body includes multipledielectric layers and multiple internal electrode layers that arelaminated. The laminated body includes a first side surface and a secondside surface opposite to each other in a laminating direction, a firstprincipal surface and a second principal surface opposite to each otherin a height direction perpendicular or substantially perpendicular tothe laminating direction, and a first end surface and a second endsurface opposite to each other in a length direction perpendicular orsubstantially perpendicular to both the laminating direction and theheight direction. The first external electrode extends in the laminatingdirection on a central portion of the second principal surface in thelength direction, from the second principal surface to respectiveportions of the first side surface and second side surface. The pair ofsecond external electrodes includes one second external electrodeextending in the laminating direction on one end of the second principalsurface in the length direction, and the other second external electrodeextending in the laminating direction on the other end of the secondprincipal surface in the length direction. The pair of insulatingcoating portions includes one insulating coating portion extending inthe laminating direction between one second external electrode and thefirst external electrode on the second principal surface, and the otherinsulating coating portion extending in the laminating direction betweenthe other second external electrode and the first external electrode onthe second principal surface. The multiple internal electrode layersinclude: multiple first internal electrode layers connected to the firstexternal electrode; and multiple second internal electrode layersconnected to each of the pair of second external electrodes. One secondexternal electrode extends from the second principal surface to aportion of at least one of the first side surface and the second sidesurface, and to a portion of the first end surface. The other secondexternal electrodes extends from the second principal surface to aportion of at least one of the first side surface and the second sidesurface, and to a portion of the second end surface. The pair ofinsulating coating portions each extends from the second principalsurface to a portion of the at least one of the respective first sidesurface and second side surface. As viewed from at least one directionin the laminating direction, an end of the pair of insulating coatingportions, which is located closest to the first principal surface, islocated closer to the first principal surface than an end of the firstexternal electrode and pair of second external electrodes, which islocated closest to the first principal surface.

According to a preferred embodiment of the present invention, as viewedfrom at least one direction in the laminating direction, the distance inthe height direction is about 20 μm or more, for example, between an endof the pair of insulating coating portions, which is located closest tothe first principal surface, and an end of the first external electrodeand pair of second external electrodes, which is located closest to thefirst principal surface.

According to a preferred embodiment of the present invention, themaximum thickness of the first external electrode on the secondprincipal surface is larger than the maximum thickness of the pair ofsecond external electrodes on the second principal surface. The maximumthickness of the pair of insulating coating portions on the secondprincipal surface is larger than the maximum thickness of the firstexternal electrode on the second principal surface.

According to a preferred embodiment of the present invention, themaximum thickness of the first external electrode on the secondprincipal surface is larger than the maximum thickness of the pair ofsecond external electrodes on the second principal surface. The maximumthickness of the pair of second external electrodes on the secondprincipal surface is larger than the maximum thickness of the pair ofinsulating coating portions on the second principal surface.

According to a preferred embodiment of the present invention, the pairof insulating coating portions includes overlapping portions thatoverlap with respective portions of the first external electrode andpair of second external electrodes in the height direction. Theoverlapping portions of the pair of insulating coating portions coverthe respective portions of the first external electrode and pair ofsecond external electrodes.

According to a preferred embodiment of the present invention, the pairof insulating coating portions includes overlapping portions thatoverlap with respective portions of the first external electrode andpair of second external electrodes in the height direction. Theoverlapping portions of the pair of insulating coating portions arecovered with the respective portions of the first external electrode andpair of second external electrodes.

According to a preferred embodiment of the present invention, the pairof insulating coating portions includes a material including adielectric ceramic, a resin, or glass.

According to a preferred embodiment of the present invention, the pairof insulating coating portions includes a material including adielectric ceramic. The dielectric ceramic includes BaTiO₃, CaTiO₃,SrTiO₃, or CaZrO₃.

According to a preferred embodiment of the present invention, the pairof insulating coating portions includes a material including a resin.The resin includes an epoxy-based resin or a polyimide-based resin.

According to a preferred embodiment of the present invention, the pairof insulating coating portions includes a material including glass. Theglass includes Ba or Sr.

According to preferred embodiments of the present invention, migrationis able to be significantly reduced or prevented along the side surfacesof the laminated body.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing an appearance of a multilayerceramic electronic component according to a first preferred embodimentof the present invention.

FIG. 2 is a side view of the multilayer ceramic electronic component inFIG. 1 as viewed from the direction of an arrow II.

FIG. 3 is a bottom view of the multilayer ceramic electronic componentin FIG. 1 as viewed from the direction of an arrow III.

FIG. 4 is a cross-sectional view of the multilayer ceramic electroniccomponent in FIG. 1 as viewed from the direction of arrows IV-IV.

FIG. 5 is a cross-sectional view of the multilayer ceramic electroniccomponent in FIG. 1 as viewed from the direction of arrows V-V.

FIG. 6 is a cross-sectional view of the multilayer ceramic electroniccomponent in FIG. 4 as viewed from the direction of arrows VI-VI.

FIG. 7 is a cross-sectional view of the multilayer ceramic electroniccomponent in FIG. 4 as viewed from the direction of arrows VII-VII.

FIG. 8 is a flow diagram showing a method of manufacturing a multilayerceramic electronic component according to the first preferred embodimentof the present invention.

FIG. 9 is a cross-sectional view showing the configuration of anapplication system to apply a conductive paste to a laminated body ofthe multilayer ceramic electronic component according to the firstpreferred embodiment of the present invention.

FIG. 10 is a cross-sectional view showing a first transfer roller and afirst scraper in contact with each other in the application system toapply the conductive paste to the laminated body of the multilayerceramic electronic component according to the first preferred embodimentof the present invention.

FIG. 11 is a cross-sectional view showing the first transfer roller andthe laminated body in contact with each other in the application systemto apply the conductive paste to the laminated body of the multilayerceramic electronic component according to the first preferred embodimentof the present invention.

FIG. 12 is a cross-sectional view showing the configuration of anapplication system to apply ceramic dielectric slurry to the laminatedbody of the multilayer ceramic electronic component according to thefirst preferred embodiment of the present invention.

FIG. 13 is a cross-sectional view showing a first transfer roller and afirst scraper in contact with each other in the application system toapply the ceramic dielectric slurry to the laminated body of themultilayer ceramic electronic component according to the first preferredembodiment of the present invention.

FIG. 14 is a cross-sectional view showing the first transfer roller andthe laminated body in contact with each other in the application systemto apply the ceramic dielectric slurry to the laminated body of themultilayer ceramic electronic component according to the first preferredembodiment of the present invention.

FIG. 15 is a cross-sectional view showing a multilayer ceramicelectronic component according to a second preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 6.

FIG. 16 is a cross-sectional view showing the multilayer ceramicelectronic component according to the second preferred embodiment of thepresent invention, similar to the cross-sectional view shown FIG. 7.

FIG. 17 is a cross-sectional view showing a multilayer ceramicelectronic component according to a third preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 6.

FIG. 18 is a cross-sectional view showing the multilayer ceramicelectronic component according to the third preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 7.

FIG. 19 is a cross-sectional view showing the multilayer ceramicelectronic component according to the third preferred embodiment of thepresent invention, similar to in the cross-sectional view shown in FIG.5.

FIG. 20 is a cross-sectional view showing a multilayer ceramicelectronic component according to a fourth preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 6.

FIG. 21 is a cross-sectional view showing the multilayer ceramicelectronic component according to the fourth preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 7.

DETAILED DESCRIPTION OF THE INVENTION

Multilayer ceramic electronic components according to respectivepreferred embodiments of the present invention will be described belowwith reference to the drawings. In the following descriptions of thepreferred embodiments, identical or corresponding portions in thefigures are denoted by identical symbols, but the descriptions of theportions will not be repeated. While multilayer ceramic capacitors willbe described as the multilayer ceramic electronic component in therespective preferred embodiments of the present invention, themultilayer ceramic electronic component is not limited to any multilayerceramic capacitor, but may be a multilayer ceramic inductor, amultilayer ceramic thermistor, or the like, for example.

First Preferred Embodiment

FIG. 1 is a perspective view showing an appearance of a multilayerceramic electronic component according to a first preferred embodimentof the present invention. FIG. 2 is a side view of the multilayerceramic electronic component in FIG. 1 as viewed from the direction ofan arrow II. FIG. 3 is a bottom view of the multilayer ceramicelectronic component in FIG. 1 as viewed from the direction of an arrowIII. FIG. 4 is a cross-sectional view of the multilayer ceramicelectronic component in FIG. 1 as viewed from the direction of arrowsIV-IV. FIG. 5 is a cross-sectional view of the multilayer ceramicelectronic component in FIG. 1 as viewed from the direction of arrowsV-V. FIG. 6 is a cross-sectional view of the multilayer ceramicelectronic component in FIG. 4 as viewed from the direction of arrowsVI-VI. FIG. 7 is a cross-sectional view of the multilayer ceramicelectronic component in FIG. 4 as viewed from the direction of arrowsVII-VII. In FIGS. 1 to 7, as will be described below, the lengthdirection of a laminated body, the height direction of the laminatedbody, and the laminating direction of the laminated body arerespectively denoted by L, T, and W.

As shown in FIGS. 1 to 7, a multilayer ceramic electronic component 100according to the first preferred embodiment of the present inventionincludes a laminated body 110, a first external electrode 121, a pair ofsecond external electrodes 122, and a pair of insulating coatingportions 130.

The laminated body 110 preferably has a cuboid or substantially cuboidouter shape, for example. The laminated body 110 includes multipledielectric layers 150 and multiple internal electrode layers 140. Thelaminated body 110 includes a first side surface 113 and a second sidesurface 114 opposite to each other in the laminating direction W, afirst principal surface 111 and a second principal surface 112 oppositeto each other in the height direction T perpendicular or substantiallyperpendicular to the laminating direction W, and a first end surface 115and a second end surface 116 opposite to each other in the lengthdirection L perpendicular or substantially perpendicular to both thelaminating direction W and the height direction T.

The laminated body 110 has the cuboid or substantially cuboid outershape as mentioned above, but preferably has corners and ridges that arerounded, for example. The corner refers to the intersection of threesurfaces of the laminated body 110, and the ridge refers to theintersection of two surfaces of the laminated body 110. At least one ofthe first principal surface 111, second principal surface 112, firstside surface 113, second side surface 114, first end surface 115, andsecond end surface 116 may include an asperity or asperities, forexample.

As for the outside dimensions of the multilayer ceramic electroniccomponent 100, for example, the dimension in the length direction L isabout 2.0 mm or more and about 2.3 mm or less, the dimension in thelaminating direction W is about 1.2 mm or more and about 1.55 mm orless, and the dimension in the height direction T is about 0.5 mm ormore and about 1.0 mm or less, for example. The outside dimensions ofthe multilayer ceramic electronic component 100 are able to be measuredwith a micrometer.

The laminated body 110 is segmented into a pair of outer layer portionsand an inner layer portion in the laminating direction W. One of thepair of outer layer portions is a portion including the first sidesurface 113 of the laminated body 110, and includes a dielectric layer150 located between the first side surface 113 and a first internalelectrode layer 141 closest to the first side surface 113 as will bedescribed below. The other of the pair of outer layer portions is aportion including the second side surface 114 of the laminated body 110,and includes a dielectric layer 150 located between the second sidesurface 114 and a second internal electrode layer 142 closest to thesecond side surface 114 as will be described below.

The inner layer portion is a region sandwiched between the pair of outerlayer portions. More specifically, the inner layer portion includesmultiple dielectric layers 150 that do not define the outer layerportions, and all of the internal electrode layers 140.

The number of multiple dielectric layers 150 laminated is preferably 20or more and 1100 or less, for example. The pair of outer layer portionsis each preferably about 10 μm or more and about 80 μm or less inthickness, for example. The multiple dielectric layers 150 included inthe inner layer portion are each preferably about 0.4 μm or more andabout 3 μm or less in thickness, for example.

The dielectric layers 150 include a perovskite-type compound containingBa or Ti.

Dielectric ceramics containing, as a main component, BaTiO₃, CaTiO₃,SrTiO₃, CaZrO₃, or the like are able to be included as a materialdefining the dielectric layers 150. In addition, materials may beincluded where the foregoing main components have an Mn compound, an Mgcompound, an Si compound, an Fe compound, a Cr compound, a Co compound,an Ni compound, an Al compound, a V compound, a rare-earth compound, orthe like added thereto as an accessory material, for example.

The multiple internal electrode layers 140 include multiple firstinternal electrode layers 141 connected to the first external electrode121 and multiple second internal electrode layers 142 connected to thesecond external electrode 122.

The number of multiple internal electrode layers 140 laminated ispreferably 10 or more and 1100 or less, for example. The multipleinternal electrode layers 140 are each preferably about 0.3 μm or moreand about 1.0 μm or less in thickness, for example. The coverage foreach of the multiple internal electrode layers 140 covering thedielectric layers 150 without any space is preferably about 50% or moreand about 95% or less, for example.

The material defining the internal electrode layers 140 is a metalselected from the group consisting of Ni, Cu, Ag, Pd, and Au, or analloy containing the metal, and, for example, an alloy of Ag and Pd isable to be included. The internal electrode layers 140 may includedielectric grains of a same or similar composition as the dielectricceramic included in the dielectric layers 150, for example.

The first internal electrode layers 141 and the second internalelectrode layers 142 are each rectangular or substantially rectangularas viewed from the laminating direction W of the laminated body 110. Thefirst internal electrode layers 141 and the second internal electrodelayers 142 are alternately disposed at regular intervals in thelaminating direction W of the laminated body 110. In addition, the firstinternal electrode layers 141 and the second internal electrode layers142 are disposed to be opposite to each other with the dielectric layers150 interposed therebetween.

The first internal electrode layers 141 each include an opposedelectrode portion located opposite to the second internal electrodelayer 142, and an extended electrode portion extended from the opposedelectrode portion to the second principal surface 112 of the laminatedbody 110. The extended electrode portion of the first internal electrodelayer 141 is extended to a central portion of the second principalsurface 112 in the length direction L of the laminated body 110.

The second internal electrode layers 142 each include an opposedelectrode portion located opposite to the first internal electrode layer141, and an extended electrode portion extended from the opposedelectrode portion to the second principal surface 112 of the laminatedbody 110. The extended electrode portion of the second internalelectrode layer 142 is extended to both ends of the second principalsurface 112 in the length direction L of the laminated body 110.

The dielectric layer 150 is located between the opposed electrodeportion of the first internal electrode layer 141 and the opposedelectrode portion of the second internal electrode layer 142, thusgenerating an electrostatic capacitance. Thus, the function of acapacitor is provided.

In the laminated body 110, as viewed from the laminating direction W ofthe laminated body 110, the location between the opposed electrodeportion and the first principal surface 111 is referred to as a firstside margin, the location between the opposed electrode portion and thesecond principal surface 112 is referred to as a second side margin, thelocation between the opposed electrode portion and the first end surface115 is referred to as a first end margin, and the location between theopposed electrode portion and the second end surface 116 is referred toas a second end margin.

The first side margin and the second side margin are each preferablyabout 5 μm or more and about 80 μm or less in thickness in the heightdirection T of the laminated body 110, for example. The first end marginand the second end margin are each preferably about 5 μm or more andabout 80 μm or less in thickness in the length direction L of thelaminated body 110, for example.

The second side margin includes the respective extended electrodeportions of the multiple first internal electrode layers 141, therespective extended electrode portions of the multiple second internalelectrode layers 142, and the multiple dielectric layers 150 adjacent toor in a vicinity of each of the extended electrode portions.

The first external electrode 121 extends in the laminating direction Win a central portion of the second principal surface 112 in the lengthdirection L, from the second principal surface 112 to respectiveportions of the first side surface 113 and second side surface 114. Thepair of second external electrodes 122 includes one second externalelectrode 122 that extends in the laminating direction W at one end ofthe second principal surface 112 in the length direction L, and theother second external electrode 122 that extends in the laminatingdirection W at the other end of the second principal surface 112 in thelength direction L. One second external electrodes 122 extends from thesecond principal surface 112 to a portion of at least one of the firstside surface 113 and the second side surface 114, and to a portion ofthe first end surface 115. The other second external electrode 122extends from the second principal surface 112 to a portion of at leastone of the first side surface 113 and the second side surface 114, andto a portion of the second end surface 116.

According to the present preferred embodiment, one second externalelectrode 122 extends in the laminating direction W at one end of thesecond principal surface 112 in the length direction L, from the secondprincipal surface 112 to respective portions of the first side surface113, second side surface 114, and first end surface 115. The othersecond external electrode 122 extends in the laminating direction W atthe other end of the second principal surface 112 in the lengthdirection L, from the second principal surface 112 to respectiveportions of the first side surface 113, second side surface 114, andsecond end surface 116.

According to the present preferred embodiment, as shown in FIG. 6, theextended electrode portion of the first internal electrode layer 141extended to the second principal surface 112 is partially not coveredwith the first external electrode 121. As shown in FIG. 7, the extendedelectrode portion of the second internal electrode layer 142 extended tothe second principal surface 112 is partially not covered with the pairof second external electrodes 122.

The first external electrode 121 and the second external electrodes 122each include a base electrode layer, and a plated layer disposed on thebase electrode layer. The base electrode layer includes at least one ofa baked layer and a thin film layer. The base electrode layer ispreferably about 10 μm or more and about 100 μm or less in thickness,for example.

The baked layer includes glass and a metal. The material defining thebaked layer is a metal selected from the group consisting of Ni, Cu, Ag,Pd, and Au, or an alloy containing the metal, and, for example, an alloyof Ag and Pd is able to be included. The baked layer may includemultiple laminated layers, for example. The baked layer may be a layerobtained by applying a conductive paste to the laminated body 110 andbaking the paste, or a layer subjected to co-firing with the internalelectrode layers 140, for example.

The thin film layer is formed by a thin-film formation method such as asputtering method or a vapor deposition method. The thin film layer is alayer of about 1 μm or less that includes metal particles, for example.

The material defining the plated layer is a metal selected from thegroup consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing themetal, and, for example, an alloy of Ag and Pd is able to be included.

The plated layer may include multiple laminated layers, for example. Inthis case, the plated layer preferably has a two-layer structure with anSn plated layer formed on an Ni plated layer, for example. The Ni platedlayer significantly reduces or prevents the base electrode layer frombeing eroded by solder used to mount the ceramic electronic component.The Sn plated layer improves the wettability to the solder used to mountthe ceramic electronic component, and the ceramic electronic componentis thus able to be easily mounted. The plated layers are preferablyabout 1.0 μm or more and about 10.0 μm or less in thickness per layer,for example.

The pair of insulating coating portions 130 includes one insulatingcoating portion 130 that extends in the laminating direction W betweenone second external electrode 122 and the first external electrode 121on the second principal surface 112, and the other insulating coatingportion 130 that extends in the laminating direction W between the othersecond external electrode 122 and the first external electrode 121 onthe second principal surface 112. The pair of insulating coatingportions 130 each extends from the second principal surface 112 to aportion of at least one of the first side surface 113 and the secondside surface 114.

According to the present preferred embodiment, the pair of insulatingcoating portions 130 each extends from the second principal surface 112to respective portions of the first side surface 113 and the second sidesurface 114. When the pair of insulating coating portions 130 eachextends from the second principal surface 112 to a portion of one of thefirst side surface 113 and the second side surface 114, the pair ofinsulating coating portions 130 each extends on the first side surface113 or second side surface 114 with the pair of second externalelectrodes each provided thereon.

The insulating coating portion 130 is preferably about 10 μm or more andabout 150 μm or less in thickness, for example. A dielectric ceramic, aresin, or glass is able to be included as a material defining theinsulating coating portions 130. When a dielectric ceramic is includedas a material defining the insulating coating portions 130, BaTiO₃,CaTiO₃, SrTiO₃, CaZrO₃, or the like is able to be included as a maincomponent. In addition, the foregoing main components may include an Mncompound, an Mg compound, an Si compound, an Fe compound, a Cr compound,a Co compound, an Ni compound, an Al compound, a V compound, arare-earth compound, or the like added thereto as an accessorycomponent, for example. The insulating coating portions 130 may beprovided by applying ceramic dielectric slurry to the laminated body 110and firing the slurry, or provided by co-firing simultaneously with alaminated chip as will be described below, for example.

When a resin is included as a material defining the insulating coatingportions 130, a resin is included which includes an epoxy-based resin ora polyimide-based resin. In this case, the insulating coating portions130 are provided by applying a resin paste to the laminated body 110,and thermally hardening the paste.

When glass is included as a material defining the insulating coatingportions 130, glass containing Ba or Sr is included. In this case, theinsulating coating portions 130 are provided by applying a glass pasteto the laminated body 110, and baking the paste.

As shown in FIG. 2, as viewed from at least one direction in thelaminating direction W, an end of the pair of insulating coatingportions 130, which is located closest to the first principal surface111, is located closer to the first principal surface 111 than an end ofthe first external electrode 121 and pair of second external electrodes122, which is located closest to the first principal surface 111. It isto be noted that an end of at least one of one insulating coatingportion 130 and the other insulating coating portion 130, which islocated closest to the first principal surface 111, is located closer tothe first principal surface 111 than an end of the first externalelectrode 121 and pair of second external electrodes 122, which islocated closest to the first principal surface 111.

According to the present preferred embodiment, as viewed from at leastone direction in the laminating direction W, the distance T13 in theheight direction T is about 20 μm or more, for example, between an endof the pair of insulating coating portions 130, which is located closestto the first principal surface 111, and an end of the first externalelectrode 121 and pair of second external electrodes 122, which islocated closest to the first principal surface 111. It is to be notedthat the distance T13 in the height direction T is about 20 μm or more,for example, between the end of at least one of one insulating coatingportion 130 and the other insulating coating portion 130, which islocated closest to the first principal surface 111, and an end of thefirst external electrode 121 and pair of second external electrode 122,which is located closest to the first principal surface 111.

According to the present preferred embodiment, as viewed from thelaminating direction W, an end of the first external electrode 121,which is located closest to the first principal surface 111, is locatedcloser to the first principal surface 111 than an end of the pair ofsecond external electrodes 122, which is located closest to the firstprincipal surface 111. As viewed from the laminating direction W, thedistance T12 in the height direction T is about 3 μm or more, forexample, between the end of the first external electrode 121, which islocated closest to the first principal surface 111, and the end of thepair of second external electrodes 122, which is located closest to thefirst principal surface 111.

According to the present preferred embodiment, as shown in FIGS. 6 and7, the maximum thickness T1 of the first external electrode 121 on thesecond principal surface 112 is larger than the maximum thickness T2 ofthe pair of second external electrodes 122 on the second principalsurface 112. The maximum thickness T3 of the pair of insulating coatingportions 130 on the second principal surface 112 is larger than themaximum thickness T1 of the first external electrode 121 on the secondprincipal surface 112.

According to the present preferred embodiment, the pair of insulatingcoating portions 130 includes overlapping portions that overlap withrespective portions of the first external electrode 121 and pair ofsecond external electrodes 122 in the height direction T. Theoverlapping portions of the pair of insulating coating portions 130cover the respective portions of the first external electrode 121 andpair of second external electrodes 122. More specifically, the laminatedbody 110 provided in advance with the first external electrode 121 andthe pair of second external electrodes 122 is provided with the pair ofinsulating coating portions 130.

The pair of insulating coating portions 130 covers, at the secondprincipal surface 112, a portion of the extended electrode portion ofthe first internal electrode layer 141, which is not covered with thefirst external electrode 121, and a portion of the extended electrodeportion of the second internal electrode layer 142, which is not coveredwith the pair of second external electrodes 122.

The respective thicknesses of the dielectric layers 150 and internalelectrode layers 140 included in the inner layer portion are measured asfollows. First, the multilayer ceramic electronic component 100 ispolished to expose a cross section perpendicular or substantiallyperpendicular to the length direction L. The exposed cross section isobserved with a scanning electron microscope. Next, the respectivethicknesses of the dielectric layers 150 and internal electrode layers140 are measured on five lines in total: a center line along thelaminating direction W, which passes through the center in the exposedcross section; and two lines drawn at regular intervals from the centerline to each side. The average value for the five measurement values ofthe dielectric layers 150 is regarded as the thickness of the dielectriclayer 150. The average value for the five measurement values of theinternal electrode layers 140 is regarded as the thickness of theinternal electrode layer 140.

It is to be noted that for each of a central portion and both ends ofthe exposed cross section in the laminating direction W, the respectivethicknesses of the dielectric layers 150 and internal electrode layers140 may be measured on the five lines mentioned above, and the averagevalue for the measurement values of the dielectric layers 150 may beregarded as the thickness of the dielectric layer 150, whereas theaverage value for the measurement values of the internal electrodelayers 140 may be regarded as the thickness of the internal electrodelayer 140, for example.

The respective thicknesses of the first side margin, the second sidemargin, the first end margin, and the second end margin are measured asfollows. First, the multilayer ceramic electronic component 100 ispolished to expose a cross section perpendicular or substantiallyperpendicular to the laminating direction W. The exposed cross sectionis observed with a microscope for measurement. The measurement locationsinclude a central portion in the length direction L for each of thefirst side margin and second side margin and a central portion in theheight direction T for each of the first end margin and second endmargin.

The maximum thickness T1 of the first external electrode 121, themaximum thickness T2 of the pair of second external electrodes 122, andthe maximum thickness T3 of the pair of insulating coating portions 130are each measured as follows. First, the multilayer ceramic electroniccomponent 100 is polished to a central location in the laminatingdirection W, thus exposing a cross section perpendicular orsubstantially perpendicular to the laminating direction W. The exposedcross section is observed with a microscope for measurement.

The distance T12 and distance T13 mentioned above are each measured byobserving a side surface of the multilayer ceramic electronic component100 with a microscope.

A method of manufacturing the multilayer ceramic electronic component100 according to the first preferred embodiment of the present inventionis described below with reference to the drawings. FIG. 8 is a flowdiagram showing a method of manufacturing the multilayer ceramicelectronic component according to the first preferred embodiment of thepresent invention.

As shown in FIG. 8, to manufacture the multilayer ceramic electroniccomponent 100 according to the first preferred embodiment of the presentinvention, first, ceramic dielectric slurry is prepared (step S1).Specifically, a ceramic dielectric powder, an additive powder, a binderresin, a dissolution liquid, and the like are dispersed and mixed, thuspreparing ceramic dielectric slurry. The ceramic dielectric slurry maybe solvent-based or water-based slurry, for example. When the ceramicdielectric slurry is a water-based coating, the ceramic dielectricslurry is prepared by mixing a water-soluble binder, a dispersant, andthe like, and a dielectric raw material dissolved in water.

Next, ceramic dielectric sheets are formed (step S2). Specifically, theceramic dielectric slurry is formed, on a carrier film, into a sheet bya die coater, a gravure coater, or the like, and dried, thus formingceramic dielectric sheets. The ceramic dielectric sheet is preferablyabout 3 μm or less in thickness, for example, from the perspective ofreducing the size of, and increasing the capacitance of the multilayerceramic electronic component 100.

Next, mother sheets are formed (step S3). Specifically, a conductivepaste is applied to the ceramic dielectric sheets so as to providepredetermined patterns, thus forming mother sheets with predeterminedinternal electrode patterns provided on the ceramic dielectric sheets. Ascreen printing method, an ink-jet method, a gravure printing method, orthe like is able to be used as a method to apply the conductive paste.The internal electrode pattern is preferably about 1.5 μm or less inthickness, for example, from the perspective of reducing the size of,and increasing the capacitance of the multilayer ceramic electroniccomponent 100. Further, as mother sheets, the ceramic dielectric sheetsobtained without undergoing the step S3 mentioned above are alsoprepared in addition to the mother sheets with the internal electrodepatterns.

Next, multiple mother sheets are stacked (step S4). Specifically, apredetermined number of mother sheets is stacked which each include onlya ceramic dielectric sheet without any internal electrode patternformed. A predetermined number of mother sheets provided with theinternal electrode patterns is stacked thereon. Furthermore, apredetermined number of mother sheets is stacked thereon which eachinclude only a ceramic dielectric sheet without any internal electrodepattern formed. Thus, a group of mother sheets is formed.

Next, the group of mother sheets is subjected to pressure bonding, thusforming a laminated block (step S5). Specifically, the group of mothersheets is subjected to pressure bonding by applying a pressure to thegroup in the stacking direction through isostatic press or rigid press,thus forming the laminated block.

Next, the laminated block is divided to form laminated chips (step S6).Specifically, the laminated block is divided into a matrix form bycutting by pushing, cutting with a dicing machine, or laser cutting,thus providing a plurality of individual laminated chips.

Next, the laminated chip is subjected to barrel polishing (step S7).Specifically, the laminated chips are encapsulated in a small boxreferred to as a barrel, along with media balls that are higher inhardness than the dielectric material, and the barrel is rotated, thuspolishing the laminated chips. Thus, the laminated chips include cornersand ridges that are rounded.

Next, the laminated chip is subjected to firing (step S8). Specifically,the laminated chip is heated, thus making the dielectric material andconductive material included in the laminated chip fired, and thusforming the laminated body 110. The firing temperature is setappropriately depending on the dielectric material and the conductivematerial, and preferably about 900° C. or higher and about 1300° C. orlower, for example.

Next, a conductive paste is applied to the surface of the laminated body110. According to the present preferred embodiment, the conductive pasteis applied to the surface of the laminated body 110 by a roller transfermethod. However, the method to apply the conductive paste is not limitedto the roller transfer method, but may be a spray coating method or adip method, for example.

FIG. 9 is a cross-sectional view showing the configuration of anapplication system to apply the conductive paste to the laminated bodyof the multilayer ceramic electronic component according to the firstpreferred embodiment of the present invention. FIG. 10 is across-sectional view showing a first transfer roller and a first scraperin contact with each other in the application system to apply theconductive paste to the laminated body of the multilayer ceramicelectronic component according to the first preferred embodiment of thepresent invention.

As shown in FIGS. 9 and 10, the application system 1 includes a firstapplication mechanism 1 a and a second application mechanism 1 b spacedfrom each other. The first application mechanism 1 a includes a firstcontainer 2 a that stores a conductive paste 10, a first supply roller 3a partially located in the first container 2 a, a first transfer roller4 a in rolling contact with an outer peripheral surface of the firstsupply roller 3 a, and a first scraper 5 a in slide contact with anouter peripheral surface of the first transfer roller 4 a.

Likewise, the second application mechanism 1 b includes a secondcontainer 2 b, a second supply roller 3 b partially located in thesecond container 2 b, a second transfer roller 4 b in rolling contactwith an outer peripheral surface of the second supply roller 3 b, and asecond scraper 5 b in slide contact with an outer peripheral surface ofthe second transfer roller 4 b. The second container 2 b is not filledwith the conductive paste 10.

The first transfer roller 4 a and the second transfer roller 4 b eachinclude a cylindrical body, and an elastic portion that covers the outerperiphery of the body. While the body preferably includes iron, thematerial of the body is not limited to any iron, but may be othermetals, or composite materials such as CFRP (Carbon Fiber ReinforcedPlastics), for example. While the elastic portion preferably includes asilicone rubber, the material of the elastic portion is not limited toany silicone rubber, but may be other rubbers that have moderatedeformation resistance, for example.

The first transfer roller 4 a and the second transfer roller 4 b eachrotate around a rotation axis ax. For each of the first transfer roller4 a and the second transfer roller 4 b, the outer peripheral surface isprovided with a first groove h1 and a pair of second grooves h2 whichare continuous annularly. The first groove h1 is provided in a centralportion in the direction of the rotation axis ax at the outer peripheralsurface for each of the first transfer roller 4 a and the secondtransfer roller 4 b. The pair of second grooves h2 is provided at bothends in the direction of the rotation axis ax at the outer peripheralsurface for each of the first transfer roller 4 a and the secondtransfer roller 4 b.

According to the present preferred embodiment, the width of the firstgroove h1 is larger than the width for each of the pair of secondgrooves h2. According to the present preferred embodiment, thecross-sectional shape of the inside region for each of the first grooveh1 and the pair of second grooves h2 is rectangular or substantiallyrectangular, but not limited to the rectangular or substantiallyrectangular shape, and may be semi-circular, semi-elliptical, or thelike, for example.

The operation of the application system 1 to apply the conductive paste10 to the laminated body 110 of the multilayer ceramic electroniccomponent 100 will be described below. First, the first supply roller 3a and the second supply roller 3 b are respectively rotated indirections opposite to each other as indicated by arrows 8. Thus, theconductive paste 10 in the first container 2 a adheres to the outerperipheral surface of the first supply roller 3 a.

In addition, the first transfer roller 4 a and the second transferroller 4 b are respectively rotated in directions opposite to each otheras indicated by arrows 9. The first transfer roller 4 a comes intorolling contact with the first supply roller 3 a. The second transferroller 4 b comes into rolling contact with the second supply roller 3 b.Thus, the conductive paste 10 adhering to the outer peripheral surfaceof the first supply roller 3 a is transferred to the outer peripheralsurface of the first transfer roller 4 a.

As shown in FIG. 10, the first scraper 5 a in slide contact with theouter peripheral surface of the first transfer roller 4 a fills theinside of the first groove h1 and the inside of the pair of secondgrooves h2 with the conductive paste 10 transferred to the outerperipheral surface of the first transfer roller 4 a, and scrapes anyexcess of the paste.

Next, multiple laminated bodies 110 supported with a carrier tape 6attached to each of first end surfaces 115 and second end surfaces 116pass between the first transfer roller 4 a and the second transferroller 4 b in the conveying direction indicated by an arrow 7, whilebeing sequentially sandwiched between the first transfer roller 4 a andthe second transfer roller 4 b. In this regard, the length direction Lof the laminated body 110 and the direction of the rotation axis ax areparallel or substantially parallel, and the laminating direction W ofthe laminated body 110 and the conveying direction of the laminated body110 are parallel or substantially parallel.

The conveying speed of the laminated body 110 is equal or substantiallyequal to the rotation speed of the outer periphery for each of the firsttransfer roller 4 a and the second transfer roller 4 b.

FIG. 11 is a cross-sectional view showing the first transfer roller andthe laminated body in contact with each other in the application systemto apply the conductive paste to the laminated body of the multilayerceramic electronic component according to the first preferred embodimentof the present invention.

As shown in FIGS. 9 and 11, the conductive paste 10 filling the insideof the first groove h1 of the first transfer roller 4 a is partiallytransferred from the second principal surface 112 of the laminated body110 to respective portions of the first side surfaces 113 and secondside surface 114, thus forming a first external electrode pattern 121 a.The conductive paste 10 filling the inside of the pair of second groovesh2 of the first transfer roller 4 a is partially transferred from thesecond principal surface 112 of the laminated body 110 to respectiveportions of the first side surfaces 113, second side surface 114, firstend surface 115, and second end surface 116, thus forming a pair ofsecond external electrode patterns 122 a.

The width of the first groove h1 is larger than the width for each ofthe pair of second grooves h2, and the maximum thickness of the firstexternal electrode pattern 121 a on the second principal surface 112 isthus larger than the maximum thickness of the pair of second externalelectrode patterns 122 a on the second principal surface 112.

In addition, a portion of the conductive paste 10 filling the inside ofthe pair of second grooves h2 also comes to the first end surface 115and the second end surface 116 from the second principal surface 112,unlike a portion of the conductive paste 10 filling the inside of thefirst groove h1, and thus, as viewed from the laminating direction W, anend of the pair of second external electrode patterns 122 a, which islocated closest to the first principal surface 111, is located fartherfrom the first principal surface 111 than an end of the first externalelectrode pattern 121 a, which is located closest to the first principalsurface 111.

Next, the first external electrode pattern 121 a and the pair of secondexternal electrode patterns 122 a formed on the laminated body 110 aresubjected to baking. Thus, baked layers that define and function as baseelectrode layers are formed (step S9). The baking temperature is, forexample, about 840° C.

Next, ceramic dielectric slurry is applied to the surface of thelaminated body 110. According to the present preferred embodiment, theceramic dielectric slurry is applied to the surface of the laminatedbody 110 by a roller transfer method. However, the method used to applythe ceramic dielectric slurry is not limited to the roller transfermethod, but may be a spray coating method or a dip method, for example.

FIG. 12 is a cross-sectional view showing the configuration of anapplication system to apply the ceramic dielectric slurry to thelaminated body of the multilayer ceramic electronic component accordingto the first preferred embodiment of the present invention. FIG. 13 is across-sectional view showing a first transfer roller and a first scraperin contact with each other in the application system to apply theceramic dielectric slurry to the laminated body of the multilayerceramic electronic component according to the first preferred embodimentof the present invention.

As shown in FIGS. 12 and 13, the application system 1 includes a firstapplication mechanism 1 a and a second application mechanism 1 b spacedfrom each other. The first application mechanism 1 a includes a firstcontainer 2 a that stores ceramic dielectric slurry 20, a first supplyroller 3 a partially located in the first container 2 a, a firsttransfer roller 4 c in rolling contact with an outer peripheral surfaceof the first supply roller 3 a, and a first scraper 5 a in slide contactwith an outer peripheral surface of the first transfer roller 4 c.

The second application mechanism 1 b includes a second container 2 b, asecond supply roller 3 b partially located in the second container 2 b,a second transfer roller 4 d in rolling contact with an outer peripheralsurface of the second supply roller 3 b, and a second scraper 5 b inslide contact with an outer peripheral surface of the second transferroller 4 d. The second container 2 b is not filled with the ceramicdielectric slurry 20.

The first transfer roller 4 c and the second transfer roller 4 d eachinclude a cylindrical body, and an elastic portion that covers the outerperiphery of the body. While the body preferably includes iron, thematerial of the body is not limited to any iron, but may be othermetals, or composite materials such as CFRP (Carbon Fiber ReinforcedPlastics, for example. While the elastic portion preferably includes asilicone rubber, the material of the elastic portion is not limited toany silicone rubber, but may be other rubbers that have moderatedeformation resistance, for example.

The first transfer roller 4 c and the second transfer roller 4 d eachrotate around a rotation axis ax. For each of the first transfer roller4 c and the second transfer roller 4 d, the outer peripheral surface isprovided with a pair of third grooves h3 which are continuous annularly.The pair of third grooves h3 is spaced from each other in the directionof the rotation axis ax at the outer peripheral surface for each of thefirst transfer roller 4 c and second transfer roller 4 d. The pair ofthird grooves h3 for each of the first transfer roller 4 c and secondtransfer roller 4 d is provided in locations corresponding to thelocations between each of the pair of second grooves h2 and the firstgroove h1 for each of the first transfer roller 4 a and second transferroller 4 b.

According to the present preferred embodiment, the width for each of thepair of third grooves h3 is larger than the width of the first grooveh1. According to the present preferred embodiment, the cross-sectionalshape of the inside region for each of the pair of third grooves h3 isrectangular or substantially rectangular, but not limited to therectangular or substantially rectangular shape, and may besemi-circular, semi-elliptical, or the like, for example.

The operation of the application system 1 to apply the ceramicdielectric slurry 20 to the laminated body 110 of the multilayer ceramicelectronic component 100 will be described below. First, the firstsupply roller 3 a and the second supply roller 3 b are respectivelyrotated in directions opposite to each other as indicated by arrows 8.Thus, the ceramic dielectric slurry 20 in the first container 2 aadheres to the outer peripheral surface of the first supply roller 3 a.

In addition, the first transfer roller 4 c and the second transferroller 4 d are respectively rotated in directions opposite to each otheras indicated by arrows 9. The first transfer roller 4 c comes intorolling contact with the first supply roller 3 a. The second transferroller 4 d comes into rolling contact with the second supply roller 3 b.Thus, the ceramic dielectric slurry 20 adhering to the outer peripheralsurface of the first supply roller 3 a is transferred to the outerperipheral surface of the first transfer roller 4 c.

As shown in FIG. 13, the first scraper 5 a in slide contact with theouter peripheral surface of the first transfer roller 4 c fills theinside of the pair of third grooves h3 with the ceramic dielectricslurry 20 transferred to the outer peripheral surface of the firsttransfer roller 4 c, and scrapes any excess paste.

Next, multiple laminated bodies 110 with first external electrodes 121and pairs of second external electrodes 122, which are supported with acarrier tape 6 attached to each of first end surfaces 115 and second endsurfaces 116 pass between the first transfer roller 4 c and the secondtransfer roller 4 d in the conveying direction indicated by an arrow 7,while being sequentially sandwiched between the first transfer roller 4c and the second transfer roller 4 d. In this regard, the lengthdirection L of the laminated body 110 and the direction of the rotationaxis ax are parallel or substantially parallel, and the laminatingdirection W of the laminated body 110 and the conveying direction of thelaminated body 110 are parallel or substantially parallel. The conveyingspeed of the laminated body 110 is equal or substantially equal to therotation speed of the outer periphery for each of the first transferroller 4 c and the second transfer roller 4 d.

According to the present preferred embodiment, the pressure ofsandwiching the laminated body 110 between the first transfer roller 4 cand the second transfer roller 4 d is higher than the pressure ofsandwiching the laminated body 110 between the first transfer roller 4 aand the second transfer roller 4 b.

FIG. 14 is a cross-sectional view showing the first transfer roller andthe laminated body in contact with each other in the application systemto apply the ceramic dielectric slurry to the laminated body of themultilayer ceramic electronic component according to the first preferredembodiment of the present invention.

As shown in FIGS. 12 and 14, the ceramic dielectric slurry 20 fillingthe inside of the pair of third grooves h3 of the first transfer roller4 c is partially transferred from the second principal surface 112 ofthe laminated body 110 to respective portions of the first side surfaces113 and second side surface 114, thus forming a pair of insulatingcoating patterns 130 a.

The width for each of the pair of third grooves h3 is larger than thewidth of the first groove h1, and the maximum thickness of the pair ofinsulating coating patterns 130 a on the second principal surface 112 isthus larger than the maximum thickness of the first external electrodepattern 121 a on the second principal surface 112.

The pressure of sandwiching the laminated body 110 between the firsttransfer roller 4 c and the second transfer roller 4 d is higher thanthe pressure of sandwiching the laminated body 110 between the firsttransfer roller 4 a and the second transfer roller 4 b, and thus, asviewed from the laminating direction W, an end of the pair of insulatingcoating patterns 130 a, which is located closest to the first principalsurface 111, is located closer to the first principal surface 111 thanan end of the first external electrode pattern 121 a and pair of secondexternal electrode patterns 122 a, which is located closest to the firstprincipal surface 111.

It is to be noted that the elastic portion for each of the firsttransfer roller 4 c and second transfer roller 4 d may include a softermaterial than the elastic portion for each of the first transfer roller4 a and the second transfer roller 4 b, for example. In this case, evenwhen the pressure of sandwiching the laminated body 110 between thefirst transfer roller 4 c and the second transfer roller 4 d is equal orsubstantially equal to the pressure of sandwiching the laminated body110 between the first transfer roller 4 a and the second transfer roller4 b, as viewed from the laminating direction W, an end of the pair ofinsulating coating patterns 130 a, which is located closest to the firstprincipal surface 111, is able to be located closer to the firstprincipal surface 111 than an end of the first external electrodepattern 121 a and pair of second external electrode patterns 122 a,which is located closest to the first principal surface 111.

Next, the pair of insulating coating patterns 130 a formed on thelaminated body 110 is subjected to baking.

Thus, the pair of insulating coating portions 130 is formed on the outersurface of the laminated body 110 (step S10). The baking temperature isset to a lower temperature than the firing temperature for the laminatedchip. When the material defining the insulating coating portions 130 isa dielectric ceramic, the baking temperature is, for example, about 900°C. When the material defining the insulating coating portions 130 is aresin, the baking temperature is, for example, about 300° C. When thematerial defining the insulating coating portions 130 is glass, thebaking temperature is, for example, about 600° C. or higher and about750° C. or lower.

Next, the laminated body 110 with the base electrode layers andinsulating coating portions is subjected to plating treatment. The baseelectrode layers are subjected to Ni plating and Sn plating in thisorder to form Ni plated layers and Sn plated layers, thus forming thefirst external electrode 121 and the pair of second external electrodes122 on the outer surface of the laminated body 110 (step S11).

The multilayer ceramic electronic component 100 is able to bemanufactured through the series of steps described above.

In the multilayer ceramic electronic component 100 according to thepresent preferred embodiment, the maximum thickness T3 of the pair ofinsulating coating portions 130 on the second principal surface 112 islarger than the maximum thickness T1 of the first external electrode 121on the second principal surface 112. Therefore, when the multilayerceramic electronic component 100 is mounted on a substrate, the pair ofinsulating coating portions 130 is brought into contact with thesubstrate to form a gap between the substrate and the first externalelectrode 121. Solder used to mount the multilayer ceramic electroniccomponent 100 on the substrate spreads out so as to fill the gap, and asolder layer of adequate thickness is able to be formed. As a result,the multilayer ceramic electronic component 100 is able to be mounted onthe substrate with adequate fixing strength. In addition, when themultilayer ceramic electronic component 100 is sealed with a resin, andfurther subjected to reflow after mounting the multilayer ceramicelectronic component 100 on the substrate, the phenomenon of blowing offthe solder molten during the reflow due to expansion of voids, referredto as solder burst, is able to be significantly reduced or prevented,because the gap between the substrate and the first external electrode121 is filled with the solder to cause no voids to remain.

Furthermore, the distances between each of the pair of second externalelectrodes 122 and the first external electrode 121 along the outersurfaces of the insulating coating portions 130 on the second principalsurface 112 are extended by the insulating coating portions 130, thussignificantly reducing or preventing the occurrence of short circuitsdue to migration along the outer surfaces of the insulating coatingportions 130 on the second principal surface 112. From this perspective,the maximum thickness T3 of at least one of one insulating coatingportion 130 and the other insulating coating portion 130 on the secondprincipal surface 112 has only to be larger than the maximum thicknessT1 of the first external electrode 121 on the second principal surface112.

In the multilayer ceramic electronic component 100 according to thepresent preferred embodiment, the laminated body 110 provided in advancewith the first external electrode 121 and the pair of second externalelectrodes 122 is provided with the pair of insulating coating portions130, and the pair of insulating coating portions 130 covers respectiveportions of the first external electrode 121 and the pair of secondexternal electrodes 122. As a result, the first external electrode 121and the pair of second external electrodes 122 are able to besignificantly reduced or prevented from peeling from the laminated body110.

In this regard, an experimental example will be described which verifiedthe relationship between the distance T13 mentioned above and theincidence of migration along the side surfaces of the laminated body110. As an experimental condition, whether migration was caused alongthe side surfaces of the laminated body 110 or not was confirmed duringa time period of about 1000 hours with a rated voltage applied to themultilayer ceramic electronic component under an environment at atemperature of about 125° C. and relative humidity of about 95%, afterthe multilayer ceramic electronic component placed on a substrate wassubjected to general condensation.

In the present experimental example, twenty pieces were prepared foreach of eight types of multilayer ceramic electronic componentsaccording to Examples 1 to 4 and Comparative Examples 1 to 4. Thedistance T13 was made to be about 20 μm for Example 1, about 80 μm forExample 2, about 140 μm for Example 3, about 200 μm for Example 4, about0 μm for Comparative Example 1, about −20 μm for Comparative Example 2,about −40 μm for Comparative Example 3, and about −60 μm for ComparativeExample 4.

It is to be noted that when the distance T13 has a negative value, asviewed from the laminating direction W, an end of the pair of insulatingcoating portions 130, which is located closest to the first principalsurface 111, is located farther from the first principal surface 111than an end of the first external electrode 121 and pair of secondexternal electrodes 122, which is located closest to the first principalsurface 111.

TABLE 1 Distance T13 (μm) Incidence Rate of Migration Example 1 20 2/20Example 2 80 1/20 Example 3 140 0/20 Example 4 200 0/20 Comparative 04/20 Example 1 Comparative −20 4/20 Example 2 Comparative −40 8/20Example 3 Comparative −60 10/20  Example 4

Table 1 summarizes experimental results according to the presentexperimental example. As shown in Table 1, the incidence rate ofmigration along the side surfaces of the laminated body 110 was about10% or less in Examples 1 to 4 with the distance T13 of about 20 μm ormore. On the other hand, the incidence rate of migration along the sidesurfaces of the laminated body 110 was about 20% or more in ComparativeExamples 1 to 4 with the distance T13 of about 0 μm or less.

From the present experimental example, it has been successfullyconfirmed that the distances between each of the pair of second externalelectrodes 122 and the first external electrode 121 along the respectivefirst side surface 113 and second side surface 114 of the laminated body110 are extended by the insulating coating portions 130, thussignificantly reducing or preventing the occurrence of short circuitsdue to migration. It has been successfully confirmed that, inparticular, when the distance T13 is about 20 μm or more, for example,short circuits due to migration along the side surfaces of the laminatedbody 110 are able to be significantly reduced or prevented.

It is to be noted that when the distance T13 is larger than about 200μm, for example, the surface areas of portions covered by the pair ofinsulating coating portions 130 are unfavorably increased in anexcessive manner for each of the first external electrode 121 and thepair of second external electrodes 122, thus making it difficult toensure the area of contact between each of the first external electrode121 and pair of second external electrode 122 and a solder in the caseof mounting the multilayer ceramic electronic component 100 on asubstrate.

Second Preferred Embodiment

A multilayer ceramic electronic component according to a secondpreferred embodiment of the present invention will be described below.It is to be noted that the multilayer ceramic electronic componentaccording to the second preferred embodiment of the present inventiondiffers from the multilayer ceramic electronic component 100 accordingto the first preferred embodiment of the present invention, only in thatthe maximum thickness of the pair of second external electrodes on thesecond principal surface is larger than the maximum thickness of thepair of insulating coating portions on the second principal surface, andthe description of the same or similar configuration as the multilayerceramic electronic component 100 according to the first preferredembodiment of the present invention will not be repeated.

FIG. 15 is a cross-sectional view showing the multilayer ceramicelectronic component according to the second preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 6.FIG. 16 is a cross-sectional view showing the multilayer ceramicelectronic component according to the second preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 7.

As shown in FIGS. 15 and 16, in a multilayer ceramic electroniccomponent 200 according to the second preferred embodiment of thepresent invention, the maximum thickness T1 of a first externalelectrode 121 on a second principal surface 112 is larger than themaximum thickness T2 of a pair of second external electrodes 122 on thesecond principal surface 112. The maximum thickness T2 of the pair ofsecond external electrodes 122 on the second principal surface 112 islarger than the maximum thickness T3 of a pair of insulating coatingportions 130 on the second principal surface 112.

In an application system 1 to apply a conductive paste 10 to a laminatedbody 110 of the multilayer ceramic electronic component 200, the widthof a first groove h1 is larger than the width for each of the pair ofsecond grooves h2. The width of the first groove h1 is larger than thewidth for each of the pair of second grooves h2, and the maximumthickness of the first external electrode pattern 121 a on the secondprincipal surface 112 is thus larger than the maximum thickness of thepair of second external electrode patterns 122 a on the second principalsurface 112.

In an application system 1 to apply ceramic dielectric slurry 20 to thelaminated body 110 of the multilayer ceramic electronic component 200,the width for each of a pair of third grooves h3 is smaller than thewidth for each of the pair of second grooves h2. The width for each ofthe pair of third grooves h3 is smaller than the width for each of thepair of second grooves h2, and the maximum thickness of a pair ofinsulating coating patterns 130 a on the second principal surface 112 isthus smaller than the maximum thickness of the pair of second externalelectrode patterns 122 a on the second principal surface 112.

In the multilayer ceramic electronic component 200 according to thepresent preferred embodiment, the maximum thickness T2 of the pair ofsecond external electrodes 122 on the second principal surface 112 islarger than the maximum thickness T3 of the pair of insulating coatingportions 130 on the second principal surface 112. Therefore, when themultilayer ceramic electronic component 200 is mounted on a substrate,the pair of insulating coating portions 130 is not brought into contactwith the substrate. Therefore, the reduced maximum thickness T1 of thefirst external electrode 121 is able to reduce the mounting height ofthe multilayer ceramic electronic component 200 on the substrate. Inaddition, the reduced maximum thickness T1 of the first externalelectrode 121 is able to reduce the equivalent series inductance (ESL),because of the shortened current pathway connecting the circuit on thesubstrate and the multilayer ceramic electronic component 200.

Third Preferred Embodiment

A multilayer ceramic electronic component according to a third preferredembodiment of the present invention will be described below. It is to benoted that the multilayer ceramic electronic component according to thethird preferred embodiment of the present invention differs from themultilayer ceramic electronic component 100 according to the firstpreferred embodiment of the present invention, mainly in that theoverlapping portions of the pair of insulating coating portions arecovered with respective portions of the first external electrode andpair of second external electrodes, and the description of the same orsimilar configuration as the multilayer ceramic electronic component 100according to the first preferred embodiment of the present inventionwill not be repeated.

FIG. 17 is a cross-sectional view showing the multilayer ceramicelectronic component according to the third preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 6.FIG. 18 is a cross-sectional view showing the multilayer ceramicelectronic component according to the third preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 7.FIG. 19 is a cross-sectional view showing the multilayer ceramicelectronic component according to the third preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 5.

As shown in FIGS. 17 and 18, the length in the length direction L of alaminated body 110 is longer for each of extended electrode portions offirst internal electrode layers 141 and extended electrode portions ofsecond internal electrode layers 142 in the multilayer ceramicelectronic component 300 according to the third preferred embodiment ofthe present invention, as compared with the multilayer ceramicelectronic component 100 according to the first preferred embodiment.

As a result, as shown in FIG. 19, the extended electrode portions of thefirst internal electrode layers 141 and the extended electrode portionsof the second internal electrode layers 142 are partially opposite toeach other with dielectric layers 150 interposed therebetween.Therefore, in the multilayer ceramic electronic component 300 accordingto the present preferred embodiment, the extended electrode portions ofthe first internal electrode layers 141 and the extended electrodeportions of the second internal electrode layers 142 also generateelectrostatic capacitance, thus resulting in increased capacitance.

According to the present preferred embodiment, the pair of insulatingcoating portions 130 includes overlapping portions that overlap withrespective portions of the first external electrode 121 and pair ofsecond external electrodes 122 in the height direction T. Theoverlapping portions of the pair of insulating coating portions 130 arecovered with the respective portions of the first external electrode 121and pair of second external electrodes 122. More specifically, thelaminated body 110 provided in advance with pair of insulating coatingportions 130 is provided with the first external electrode 121 and thepair of second external electrodes 122. Therefore, in manufacturing themultilayer ceramic electronic component 300 according to the presentpreferred embodiment, the step S10 mentioned above is carried out priorto the step S9 mentioned above.

The pair of insulating coating portions 130 covers, at the secondprincipal surface 112, the portions where the first external electrode121 and the pair of second external electrodes 122 are opposite to eachother, and the first internal electrode layers 141 and the secondinternal electrode layers 142 are able to be significantly reduced orprevented from being short-circuited in the formation of the firstexternal electrode 121 and the pair of second external electrodes 122.

Fourth Preferred Embodiment

A multilayer ceramic electronic component according to a fourthpreferred embodiment of the present invention will be described below.It is to be noted that the multilayer ceramic electronic componentaccording to the fourth preferred embodiment of the present inventiondiffers from the multilayer ceramic electronic component 300 accordingto the third preferred embodiment of the present invention, only in thatthe maximum thickness of the pair of second external electrodes on thesecond principal surface is larger than the maximum thickness of thepair of insulating coating portions on the second principal surface, andthe description of the same or similar configuration as the multilayerceramic electronic component 300 according to the third preferredembodiment of the present invention will not be repeated.

FIG. 20 is a cross-sectional view showing the multilayer ceramicelectronic component according to the fourth preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 6.FIG. 21 is a cross-sectional view showing the multilayer ceramicelectronic component according to the fourth preferred embodiment of thepresent invention, similar to the cross-sectional view shown in FIG. 7.

As shown in FIGS. 20 and 21, in a multilayer ceramic electroniccomponent 400 according to the fourth preferred embodiment of thepresent invention, the maximum thickness T1 of a first externalelectrode 121 on a second principal surface 112 is larger than themaximum thickness T2 of a pair of second external electrodes 122 on thesecond principal surface 112. The maximum thickness T2 of the pair ofsecond external electrodes 122 on the second principal surface 112 islarger than the maximum thickness T3 of a pair of insulating coatingportions 130 on the second principal surface 112.

Therefore, when the multilayer ceramic electronic component 400 ismounted on a substrate, the pair of insulating coating portions 130 isnot brought into contact with the substrate. Therefore, the reducedmaximum thickness T1 of the first external electrode 121 is able toreduce the mounting height of the multilayer ceramic electroniccomponent 400 on the substrate. In addition, the reduced maximumthickness T1 of the first external electrode 121 is able to reduce theequivalent series inductance (ESL), because of the shortened currentpathway connecting the circuit on the substrate and the multilayerceramic electronic component 400.

In the preferred embodiments described above, the configurations whichare able to be combined may be combined with each other.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. A multilayer ceramic electronic componentcomprising: a laminated body including: a plurality of dielectric layersand a plurality of internal electrode layers laminated in a laminatingdirection; and a first side surface and a second side surface oppositeto each other in the laminating direction, a first principal surface anda second principal surface opposite to each other in a height directionperpendicular or substantially perpendicular to the laminatingdirection, and a first end surface and a second end surface opposite toeach other in a length direction perpendicular or substantiallyperpendicular to the laminating direction and the height direction; afirst external electrode extending in the laminating direction on acentral portion of the second principal surface in the length direction,over the second principal surface to respective portions of the firstside surface and second side surfaces; a pair of second externalelectrodes including: one second external electrode extending in thelaminating direction on one end of the second principal surface in thelength direction; and another second external electrode extending in thelaminating direction on the other end of the second principal surface inthe length direction; and a pair of insulating coating portionsincluding: one insulating coating portion extending in the laminatingdirection between the one second external electrode and the firstexternal electrode on the second principal surface; and anotherinsulating coating portion extending in the laminating direction betweenthe another second external electrode and the first external electrodeon the second principal surface; wherein the plurality of internalelectrode layers include: a plurality of first internal electrode layersconnected to the first external electrode; and a plurality of secondinternal electrode layers connected to each of the pair of secondexternal electrodes; the one second external electrode extends from thesecond principal surface to a portion of at least one of the first sidesurface and the second side surface, and to a portion of the first endsurface; the another second external electrode extends from the secondprincipal surface to a portion of at least one of the first side surfaceand the second side surface, and to a portion of the second end surface;the pair of insulating coating portions each extends from the secondprincipal surface to a portion of the at least one of the first sidesurface and the second side surface; and as viewed from at least onedirection in the laminating direction, an end of the pair of insulatingcoating portions, which is located closest to the first principalsurface, is located closer to the first principal surface than an end ofthe first external electrode and pair of second external electrodes,which is located closest to the first principal surface.
 2. Themultilayer ceramic electronic component according to claim 1, wherein asviewed from at least one direction in the laminating direction, adistance in the height direction is about 20 μm or more between an endof the pair of insulating coating portions, which is located closest tothe first principal surface, and an end of the first external electrodeand pair of second external electrodes, which is located closest to thefirst principal surface.
 3. The multilayer ceramic electronic componentaccording to claim 1, wherein a maximum thickness of the first externalelectrode on the second principal surface is larger than a maximumthickness of the pair of second external electrodes on the secondprincipal surface; and a maximum thickness of the pair of insulatingcoating portions on the second principal surface is larger than themaximum thickness of the first external electrode on the secondprincipal surface.
 4. The multilayer ceramic electronic componentaccording to claim 1, wherein a maximum thickness of the first externalelectrode on the second principal surface is larger than a maximumthickness of the pair of second external electrodes on the secondprincipal surface; and the maximum thickness of the pair of secondexternal electrodes on the second principal surface is larger than amaximum thickness of the pair of insulating coating portions on thesecond principal surface.
 5. The multilayer ceramic electronic componentaccording to claim 1, wherein the pair of insulating coating portionsincludes overlapping portions that overlap with respective portions ofthe first external electrode and the pair of second external electrodesin the height direction; and the overlapping portions of the pair ofinsulating coating portions cover the respective portions of the firstexternal electrode and the pair of second external electrodes.
 6. Themultilayer ceramic electronic component according to claim 1, whereinthe pair of insulating coating portions includes overlapping portionsthat overlap with respective portions of the first external electrodeand pair of second external electrodes in the height direction; and theoverlapping portions of the pair of insulating coating portions arecovered with the respective portions of the first external electrode andpair of second external electrodes.
 7. The multilayer ceramic electroniccomponent according to claim 1, wherein the pair of insulating coatingportions includes a material including a dielectric ceramic, a resin, orglass.
 8. The multilayer ceramic electronic component according to claim7, wherein the pair of insulating coating portions includes a materialincluding the dielectric ceramic; and the dielectric ceramic includesBaTiO₃, CaTiO₃, SrTiO₃, or CaZrO₃.
 9. The multilayer ceramic electroniccomponent according to claim 7, wherein the pair of insulating coatingportions includes a material including the resin, and the resin includesone of an epoxy-based resin and a polyimide-based resin.
 10. Themultilayer ceramic electronic component according to claim 7, whereinthe pair of insulating coating portions includes a material includingthe glass, and the glass includes Ba or Sr.
 11. The multilayer ceramicelectronic component according to claim 1, wherein the laminated body issegmented into a pair of outer layer portions and an inner layer portionin the laminating direction; and each of the pair of the outer layerportions includes one of the plurality dielectric layers and one of theplurality internal electrode layers.
 12. The multilayer ceramicelectronic component according to claim 1, wherein each of the pluralityfirst internal electrode layers includes a first opposed electrodeportion located opposite to a respective one of the plurality secondinternal electrode layers, and an extended electrode portion thatextends from the opposed electrode portion to the second principalsurface of the laminated body.
 13. The multilayer ceramic electroniccomponent according to claim 12, wherein each of the plurality secondinternal electrode layers includes a second opposed electrode portionlocated opposite to a respective one of the plurality first internalelectrode layers, and an extended electrode portion that extends fromthe opposed electrode portion to the second principal surface of thelaminated body.
 14. The multilayer ceramic electronic componentaccording to claim 13, wherein the first opposed electrode portion andthe second opposed electrode portion define an electrostatic capacitor.15. The multilayer ceramic electronic component according to claim 1,wherein the first external electrode and the pair of second externalelectrodes each include a base electrode layer and a plated layer on thebase electrode layer.
 16. The multilayer ceramic electronic componentaccording to claim 15, wherein the base electrode layer includes atleast one of a baked layer and a thin film layer.
 17. The multilayerceramic electronic component according to claim 15, wherein the platedlayer includes a plurality of laminated layers.
 18. The multilayerceramic electronic component according to claim 4, wherein themultilayer ceramic electronic component is mounted on a substrate, thepair of insulating coating portions contacts with the substrate, and agap is defined between the substrate and the first external electrode.19. The multilayer ceramic electronic component according to claim 18,wherein the gap is filled with solder.
 20. The multilayer ceramicelectronic component according to claim 5, wherein the multilayerceramic electronic component is mounted on a substrate and the pair ofinsulating coating portions do not contact with the substrate.